High-order packaging with low visibility in semiconductor industry is the focus of investment.

3/9/2023 11:11:30 AM

Tan Laykoon, CEO of STATS ChipPAC Group, Singapore's packaging and testing factory, was interviewed after the opening ceremony of its * * * factory on the 17th, pointing out that there are uncertain factors in the current economy, which interferes with the visibility of the semiconductor industry. In this case, Star Chip Pac continues to specialize in small-scale and high-level packaging, including flip-chip packaging and wafer-level packaging, which is still the main investment direction. At the same time, based on the high gold price, Star Chip Pac still follows customers. The following is a summary of the interview.

Q: What do you think of the boom in 2012?

A: At present, there are many uncertainties in the overall economy, including European debt and American economic problems. As for emerging markets such as the mainland, demand continues to grow, but the inflation problem is getting worse. Local governments have offered suppression policies, so the overall demand will be suppressed in the short term. Under the above uncertainties, the visibility of the semiconductor industry in 2012 is still low.

Although the uncertainty of semiconductor is rising, the difference between Xingke Jinpeng and other competitors is that it emphasizes small and high-end packaging technology. With the development of terminal mobile devices, the demand for smart phones and tablet computers is increasing, and the chips used by them are gradually moving towards integration. As the size becomes smaller and the lines become denser, the demand for high-level packaging testing will be stronger, including diffusion wafer-level packaging and flip-chip packaging. Therefore, Xingke Jinpeng expanded its production capacity in 2011 in order to seize the growth opportunities.

Xingke jinpeng used to cultivate with the wafer factory for a long time! And good cooperative relations, * * * is closely related to TSMC. In South Korea, it maintains close cooperative relations with Samsung Electronics, while Singapore is a former licensed semiconductor that has been merged into Global Foundries. As for the mainland, it has a good strategic position in the Eco system. Therefore, although the visibility of semiconductors was not good in 2012, these good cooperative relationships will provide customers with one-time integrated services, and Xingke Jinpeng has great confidence in future operations.

Q: What is the strategy of Xingke Jinpeng in copper wire bonding and packaging?

A: At present, the revenue of copper wire bonding process is about 12% of that of Jinpeng of Astrology Department. The customer groups cover the United States, * * * and mainland China, among which * * * and mainland China have faster switching speed for IC design customers. It is estimated that about 20 customers have started to adopt copper wire bonding packaging process.

Xingke Jinpeng expects that the demand for copper wire bonding process will continue to grow in 2012, so it plans to increase the number of copper wire bonding machines in 2012. At present, Xingke Jinpeng has more than 1,000 sets. I can't put forward the specific target of copper wire bonding process in 2012, because whether to switch to copper wire bonding process depends on customer demand.

In terms of the proportion of product and service revenue, high-level Flip Chip and wafer-level packaging revenue accounted for 35% of the total revenue of Astrology Jinpeng, testing revenue accounted for 20%, and the remaining 45% was wire packaging.

Q: One of the production bases of Xingke Jinpeng is in Thailand. What is the impact of the flood in Thailand on the company? How to deal with it?

A: The flood in Thailand really affected the operation of Xingke Jinpeng's local factory, and the factory in Thailand was still shut down until the beginning of December. The Thai factory mainly focuses on production line and test capacity, in which the line order is transferred to the Singapore factory, and the test business is undertaken by the Shanghai factory, which has little impact. It is estimated that the impact on revenue should be below 10%.

Q: What is the investment trend of Xingke Jinpeng in 2012?

A: In 2012, Xingke Jinpeng's capital expenditure accounted for about 15-20% of its revenue. In 2012, it locked in continuous investment in new products, including flip-chip packaging, fan-out wafer bumps, testing and copper wire bonding.

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